Division B
Acceptable Solutions
Part 5 — Environmental Separation
Section 5.3. Heat Transfer
(See Appendix A and Part 10.)(See Appendix A.)
5.3.1. Thermal Resistance of Assemblies
5.3.1.1. Required Resistance to Heat Transfer
(See Appendix A.)1) 
Except as provided in Sentence (2), where a building component or assembly will be subjected to an intended temperature differential, the component or assembly shall include
materials to resist heat transfer or a means to dissipate transferred heat in
accordance with the remainder of this Subsection.
Except as provided in Sentence (2), where a building component or assembly will be subjected to an intended temperature differential, the component or assembly shall include
materials to resist heat transfer or a means to dissipate transferred heat in
accordance with the remainder of this Subsection.
2) The installation of materials to resist heat transfer in accordance with the remainder of this Subsection is not required where it can be shown that uncontrolled
heat transfer will not adversely affect any of
The installation of materials to resist heat transfer in accordance with the remainder of this Subsection is not required where it can be shown that uncontrolled
heat transfer will not adversely affect any ofa) the health or safety of building users,
b) the intended use of the building, or
c) the operation of building services.
5.3.1.2. Properties to Resist Heat Transfer or Dissipate Heat
(See Appendix A.)1) Taking into account the conditions on either side of the environmental separator, materials and components installed to provide the required
resistance to heat transfer or the means implemented to dissipate
heat shall provide sufficient resistance or dissipation,
Taking into account the conditions on either side of the environmental separator, materials and components installed to provide the required
resistance to heat transfer or the means implemented to dissipate
heat shall provide sufficient resistance or dissipation,a) to minimize surface condensation on the warm side of the component
or assembly,
b) in conjunction with other materials and components in the assembly,
to minimize condensation within the component or assembly,
c) in conjunction with systems installed for space conditioning,
to meet the interior design thermal conditions for the intended occupancy, and
d) to minimize ice damming on sloped roofs.
(See Appendix A.)5.3.1.3. Location and Installation of Materials Providing Thermal Resistance
1) Where a material required by Article 5.3.1.1. is intersected by a building assembly, penetrated by a high conductance component or interrupted by expansion, control or construction joints, and where
condensation is likely to occur at these intersections, penetrations or
interruptions, sufficient thermal resistance shall be provided so as to minimize
condensation at these locations.
Where a material required by Article 5.3.1.1. is intersected by a building assembly, penetrated by a high conductance component or interrupted by expansion, control or construction joints, and where
condensation is likely to occur at these intersections, penetrations or
interruptions, sufficient thermal resistance shall be provided so as to minimize
condensation at these locations.
2) Materials providing required thermal resistance shall have sufficient inherent resistance to airflow or be positioned in the assembly so
as to prevent convective airflow through and around the material.
(See Appendix A.)
Materials providing required thermal resistance shall have sufficient inherent resistance to airflow or be positioned in the assembly so
as to prevent convective airflow through and around the material.
(See Appendix A.) 3) Spray-in-place polyurethane insulation shall be installed in accordance with the requirements of CAN/ULC-S705.2, “Thermal Insulation – Spray-Applied Rigid Polyurethane Foam, Medium Density — Application.”
Spray-in-place polyurethane insulation shall be installed in accordance with the requirements of CAN/ULC-S705.2, “Thermal Insulation – Spray-Applied Rigid Polyurethane Foam, Medium Density — Application.”